Method of manufacturing image display device

ABSTRACT

According to a method of manufacturing an image display device of the present invention, a photo-curable resin composition in a liquid state is applied to a surface of a light-transmitting cover member including a light-shielding layer or a surface of the image display member to a thickness greater than that of the light-shielding layer. Then, in this state, the photo-curable resin composition is irradiated with a UV ray to be pre-cured, thereby forming a pre-cured resin layer. Next, the image display member and the light-transmitting cover member are stacked via the pre-cured resin layer and thereafter, the pre-cured resin layer is irradiated with a UV ray to be completely cured, thereby forming a light-transmitting cured resin layer.

TECHNICAL FIELD

The present invention relates to a method of manufacturing an imagedisplay device by bonding and stacking, via a light-transmitting curedresin layer, an image display member such as a liquid crystal displaypanel and a light-transmitting cover member such as a transparentprotective sheet to be arranged on the side of a surface of the imagedisplay member.

BACKGROUND ART

An image display device such as a liquid crystal display panel used ininformation terminals such as smartphones is manufactured by providing aphoto-curable resin composition between an image display member such asa liquid crystal display panel and an organic EL panel and alight-transmitting cover member, and then irradiating the compositionwith a UV ray and curing the composition to form a light-transmittingcured resin layer, thereby bonding and stacking the image display memberand the light-transmitting cover member (Patent Literature 1).

A light-shielding layer is provided on a peripheral part of a surface ofthe light-transmitting cover member on the side of the image displaypart to enhance brightness and contrast of a display image. Hence,curing of the photo-curable resin composition held between thelight-shielding layer and the image display member does not proceedsufficiently, so that sufficient adhesive force cannot be achieved. Thismay cause the problem of separation between the light-transmitting covermember and the image display member, reduction in image quality due toentry of humidity into a gap between the light-transmitting cover memberand the image display member, and the like.

In response, it has been suggested that a heat polymerization initiatoris mixed with the photo-curable resin composition to form athermosetting and photo-curable resin composition, the thermosetting andphoto-curable resin composition is applied to the surface of thelight-transmitting cover member on which the light-shielding layer hasbeen formed, the resultant coated surface is placed over the imagedisplay member, the thermosetting and photo-curable resin composition isirradiated with a UV ray to be photo-cured, and then the entirestructure is heated to heat-cure the thermosetting and photo-curableresin composition held between the light-shielding layer and the imagedisplay member (Patent Literature 2).

CITATION LIST Patent Literature

-   Patent Literature 1: International Publication No. 2010/027041-   Patent Literature 2: International Publication No. 2008/126860

SUMMARY OF INVENTION Technical Problem

The technique of Patent Literature 2 is expected to overcome theproblems concerned in Patent Literature 1. However, the heatpolymerization initiator is used simultaneously with aphotopolymerization initiator, and heat polymerization process should beperformed in addition to photopolymerization process. This leads to theproblems such as increase in burden of a capital investment for the heatpolymerization process and reduction in preservation stability of thethermosetting and photo-curable resin composition. Further, curingprocess has not been performed yet at a time when the light-transmittingcover member coated with the thermosetting and photo-curable resincomposition and the image display member are placed one above the other.Hence, the resin composition is eliminated from between thelight-shielding layer and the surface of the light-transmitting covermember, so that a step between the light-shielding layer and the surfaceof the light-transmitting cover member cannot be canceled. This may alsocause the problems of generation of air bubbles and interlayerdelamination between the light-transmitting cover member and the resin.

It is an object of the present invention to solve the aforementionedproblems in the conventional techniques. An object of the presentinvention is to manufacture an image display device such that, evenwithout performing heat polymerization process, a photo-curable resincomposition between a light-shielding layer and an image display memberis photo-cured sufficiently without being eliminated from therebetween,and a step between the light-shielding layer and a surface of alight-transmitting cover member can be canceled.

Solution to Problem

The present inventors have found that a light-transmitting cured resinlayer between a light-shielding layer and an image display member can bephoto-cured sufficiently without being eliminated from therebetween anda step between the light-shielding layer and a light-shielding layerforming surface of a light-transmitting cover member can be canceled byapplying a liquid photo-curable resin composition once to a surface ofthe light-transmitting cover member including the light-shielding layeror a surface of the image display member to a thickness greater thanthat of the light-shielding layer, then by irradiating the appliedphoto-curable resin composition entirely or at least part of the appliedphoto-curable resin composition existing on the light-shielding layerwith a UV ray to pre-cure the photo-curable resin composition, then bystacking via a resultant pre-cured resin layer the image display memberand the light-transmitting cover member, and then by completely curingthe resin layer with UV irradiation. As a result, the inventors attainedthe present invention.

To be specific, the present invention provides a method of manufacturingan image display device where an image display member and alight-transmitting cover member with a light-shielding layer formed on aperipheral part thereof are stacked via a light-transmitting cured resinlayer formed of a liquid photo-curable resin composition, such that alight-shielding layer forming surface of the light-transmitting covermember is arranged on the side of the image display member. The methodincludes the following steps (A) to (D).

<Step (A)>

A step of applying the liquid photo-curable resin composition to thelight-shielding layer forming surface of the light-transmitting covermember or a surface of the image display member to a thickness greaterthan that of the light-shielding layer so as to cancel a step formedbetween the light-shielding layer and the light-shielding layer formingsurface of the light-transmitting cover member.

<Step (B)>

A step of irradiating the applied photo-curable resin composition with aUV ray to pre-cure the photo-curable resin composition, thereby forminga pre-cured resin layer.

<Step (C)>

A step of bonding the light-transmitting cover member to the imagedisplay member such that the light-shielding layer and the pre-curedresin layer are placed inside.

<Step (D)>

A step of irradiating the pre-cured resin layer held between the imagedisplay member and the light-transmitting cover member with a UV ray tocompletely cure the pre-cured resin layer to stack the image displaymember and the light-transmitting cover member via thelight-transmitting cured resin layer, thereby obtaining the imagedisplay device.

A preferred aspect of the step (B) can include the following step.

To be specific, in this step, at least part of the photo-curable resincomposition existing on the light-shielding layer is irradiated with aUV ray to be pre-cured to make the cure rate of the pre-cured resinlayer on the light-shielding layer from 30 to 80%. In this case, it ispreferred that the cure rate of the pre-cured resin layer on the surfaceof the light-transmitting cover member be from 0 to 80%. It is alsopreferred that the cure rate of the pre-cured resin layer on thelight-shielding layer be higher than that of the pre-cured resin layeron the surface of the light-transmitting cover member. It is preferredthat such cure rates be achieved by disposing a shielding plate toshield a UV ray or an attenuation plate to attenuate a UV ray between aUV source and the applied photo-curable resin composition during UVirradiation.

Advantageous Effects of Invention

According to the method of manufacturing an image display device of thepresent invention, a liquid photo-curable resin composition is appliedto a surface of a light-transmitting cover member including alight-shielding layer or a surface of an image display member to athickness greater than that of the light-shielding layer. Then, thephoto-curable resin composition is irradiated with a UV ray to bepre-cured, thereby forming a pre-cured resin layer at least on thelight-shielding layer. Next, the image display member and thelight-transmitting cover member are stacked via the pre-cured resinlayer and thereafter, the pre-cured resin layer is irradiated with a UVray to be completely cured, thereby forming a light-transmitting curedresin layer. Thus, even without performing heat polymerization process,the light-transmitting cured resin layer between the light-shieldinglayer and the image display member is photo-cured sufficiently withoutbeing eliminated from therebetween. Further, a step between thelight-shielding layer and a light-shielding layer forming surface of thelight-transmitting cover member can be canceled.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1A is an explanatory view of a step (A) of a method ofmanufacturing an image display device of the present invention.

FIG. 1B is an explanatory view of the step (A) of the method ofmanufacturing the image display device of the present invention.

FIG. 1C is an explanatory view of a step (B) of the method ofmanufacturing the image display device of the present invention.

FIG. 1D is an explanatory view of the step (B) of the method ofmanufacturing the mage display device of the present invention.

FIG. 1E is an explanatory view of a step (C) of the method ofmanufacturing the image display device of the present invention.

FIG. 1F is an explanatory view of a step (D) of the method ofmanufacturing the image display device of the present invention.

FIG. 1G is an explanatory view of the step (D) of the method ofmanufacturing the image display device of the present invention.

FIG. 2A is an explanatory view of a step (AA) of the method ofmanufacturing the image display device of the present invention.

FIG. 2B is an explanatory view of a step (BB) of the method ofmanufacturing the image display device of the present invention.

FIG. 2C is an explanatory view of the step (BB) of the method ofmanufacturing the image display device of the present invention.

FIG. 2D is an explanatory view of a step (CC) of the method ofmanufacturing the image display device of the present invention.

FIG. 2E is an explanatory view of a step (DD) of the method ofmanufacturing the image display device of the present invention.

FIG. 2F is an explanatory view of the step (DD) of the method ofmanufacturing the image display device of the present invention.

FIG. 3A is an explanatory view of a step (a) of the method ofmanufacturing the image display device of the present invention.

FIG. 3B is an explanatory view of the step (a) of the method ofmanufacturing the image display device of the present invention.

FIG. 3C is an explanatory view of a step (b) of the method ofmanufacturing the image display device of the present invention.

FIG. 3D is an explanatory view of the step (b) of the method ofmanufacturing the image display device of the present invention.

FIG. 3E is an explanatory view of a step (c) of the method ofmanufacturing the image display device of the present invention.

FIG. 3F is an explanatory view of the step (a) of the method ofmanufacturing the image display device of the present invention.

FIG. 3G is an explanatory view of a step (d) of the method ofmanufacturing the image display device of the present invention.

FIG. 4A is an explanatory view of a step (aa) of the method ofmanufacturing the image display device of the present invention.

FIG. 4B is an explanatory view of a step (bb) of the method ofmanufacturing the image display device of the present invention.

FIG. 4C is an explanatory view of the step (bb) of the method ofmanufacturing the image display device of the present invention.

FIG. 4D is an explanatory view of a step (cc) of the method ofmanufacturing the image display device of the present invention.

FIG. 4E is an explanatory view of a step (dd) of the method ofmanufacturing the image display device of the present invention.

FIG. 4F is an explanatory view of the step (dd) of the method ofmanufacturing the image display device of the present invention.

FIG. 5 is an explanatory view of an adhesive strength test of alight-transmitting cured resin layer.

FIG. 6A is an explanatory view of an aspect of application of aphoto-curable resin composition to a light-transmitting cover member inExample 4.

FIG. 6B is an explanatory view of the aspect of application of thephoto-curable resin composition to the light-transmitting cover memberin Example 4.

FIG. 7 is an explanatory view of an aspect of application of aphoto-curable resin composition to a light-transmitting cover member inComparative Example 1.

FIG. 8 is an explanatory view of an aspect of application of aphoto-curable resin composition to a light-transmitting cover member inComparative Example 2.

FIG. 9 is an explanatory view of an aspect of application of aphoto-curable resin composition to a light-transmitting cover member inComparative Example 3.

DESCRIPTION OF EMBODIMENTS

Each of steps (A) to (D) of a method of manufacturing an image displaydevice of the present invention will be described below in detail byreferring to the drawings.

<Step (A) (Application Step)>

First, as shown in FIG. 1A, a light-transmitting cover member 2 isprepared having a light-shielding layer 1 formed on a peripheral part ofone surface thereof. Then, as shown in FIG. 1B, a liquid photo-curableresin composition 3 is applied to a light-shielding layer formingsurface 2 a of the light-transmitting cover member 2 to a thicknessgreater than that of the light-shielding layer 1 so as to cancel a step4 formed between the light-shielding layer 1 and the light-shieldinglayer forming surface 2 a of the light-transmitting cover member 2. Morespecifically, the photo-curable resin composition 3 is applied, to beflattened, on the entire light-shielding layer forming surface 2 a ofthe light-transmitting cover member 2 including a surface of thelight-shielding layer 1 so as to avoid generation of a step. Thus, thephoto-curable resin composition 3 is applied to a thickness, preferablyfrom 1.2 to 50 times, and more preferably, from twice to 30 times thatof the light-shielding layer 1.

The photo-curable resin composition 3 may be applied several times so asto obtain a required thickness.

The light-transmitting cover member 2 is required only to havelight-transmitting properties that allow an image formed on an imagedisplay member to be recognized visually. A plate-like material and asheet-like material of glass, acrylic resin, polyethylene terephthalate,polyethylene naphthalate, polycarbonate and the like are applicable.These materials can be subjected to a single-sided or double-sided hardcoating treatment and an antireflection treatment, for example. Thephysical properties of the light-transmitting cover member 2 such as athickness and elasticity can be determined appropriately according to apurpose of use.

The light-shielding layer 1 is provided to enhance an image contrast,for example, and is formed by applying a coating material colored inblack and the like by screen printing process, for example, and thendrying and curing the coating material. The light-shielding layer 1generally has a thickness of from 5 to 100 and this thicknesscorresponds to the step 4.

The photo-curable resin composition 3 used in this step is in a liquidstate. Using the liquid material can cancel the step 4 formed betweenthe light-shielding layer 1 and the light-shielding layer formingsurface 2 a of the light-transmitting cover member 2. The liquid statementioned herein means one having a viscosity of from 0.01 to 100 Pa·s(25° C.) as measured with a cone-plate rheometer.

Examples of the photo-curable resin composition 3 may include onecontaining a photoradical polymerizable poly(meth)acrylate such as apolyurethane-based (meth)acrylate and a polyisoprene-based(meth)acrylate, and a photopolymerization initiator as main components.The term “(meth)acrylate” mentioned herein includes both acrylate andmethacrylate.

Specific and preferred examples of the photoradical polymerizablepoly(meth)acrylate can include (meth)acrylate-based oligomers having apolyisoprene, polyurethane, or polybutadiene skeleton.

Specific and preferred examples of the (meth)acrylate-based oligomerhaving a polyisoprene skeleton can include compounds formed byesterification between a maleic anhydride adduct of polyisoprene polymerand 2-hydroxyethyl methacrylate (UC102 (molecular weight of 17,000 interms of polystyrene), available from KURARAY CO., LTD.; UC203(molecular weight of 35,000 in terms of polystyrene), available fromKURARAY CO., LTD.; and UC-1 (molecular weight of about 25,000 in termsof polystyrene), available from KURARAY CO., LTD.).

Specific and preferred examples of the (meth)acrylate-based oligomerhaving a polyurethane skeleton can include aliphatic urethane acrylates(EBECRYL230 (molecular weight of 5000), available from DAICEL-CYTECCompany LTD.; and UA-1, available from Light Chemical Industries Co.,Ltd.).

One publicly known is applicable as the (meth)acrylate-based oligomerhaving a polybutadiene skeleton.

A publicly known photoradical polymerization initiator is applicable asthe photopolymerization initiator. Examples of the photoradicalpolymerization initiator can include 1-hydroxy-cyclohexylphenyl ketone(IRGACURE 184, available from Ciba Specialty Chemicals Inc.),2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)benzyl]-phenyl}-2-methyl-1-propan-1-one(IRGACURE 127, available from Ciba Specialty Chemicals Inc.),benzophenone, and acetophenone.

The aforementioned photopolymerization initiator, if it is too littlerelative to 100 parts by mass of the photoradical polymerizablepoly(meth)acrylate, results in insufficient curing at the time of UVirradiation. If it is too much, output gas is increased due to cleavageto tend to suffer a foaming failure. Thus, the amount of thephotopolymerization initiator is preferably from 0.1 to 5 parts by mass,and more preferably from 0.2 to 3 parts by mass.

The liquid photo-curable resin composition 3 can further contain apublicly known plasticizer (flexibility imparting agent) such asterpene-based hydrogenated resins, polybutadiene and polyisoprene havingcompatibility with the photoradical polymerizable poly(meth)acrylate.These plasticizers are usable as a tackifier as described later.

The photo-curable resin composition 3 can contain a reactive diluent.Preferred examples of the reactive diluent can include 2-hydroxypropylmethacrylate, benzyl acrylate, and dicyclopentenyloxyethyl methacrylate.

The photo-curable resin composition 3 can further contain, if necessary,a general additive such as an adhesion promoter such as a silanecoupling agent, and an antioxidant.

The photo-curable resin composition 3 can also contain a chain transferagent for control of a molecular weight. Examples of the chain transferagent may include 2-mercaptoethanol, lauryl mercaptan, glycidylmercaptan, mercaptoacetic acid, 2-ethylhexyl thioglycolate,2,3-dimethylcapto-1-propanol, and α-methylstyrene dimer.

UV irradiation in the step (B) described later may function to reducethe initial adhesive strength (what is called tackiness) and theeventual adhesive strength of the photo-curable resin composition 3.Thus, it is desirable that a material what is called a tackifier bemixed with the photo-curable resin composition 3. Examples of theapplicable tackifier used may include terpene-based resins such asterpene resins, terpene phenol resins, and terpene hydrogenated resins;rosin resins such as natural rosin, polymerized rosin, rosin ester, andhydrogenated rosin; and petroleum resins such as polybutadiene andpolyisoprene. The amount of such a tackifier to be added is preferablyfrom 40 to 70 parts by mass with respect to 100 parts by mass of thephoto-curable resin composition. The curing level of the photo-curableresin composition 3 tends to increase with a greater quantity of a UVray applied in the step (B). Thus, it is preferred that the tackifier bemixed more within the aforementioned range.

A base material of the photo-curable resin composition 3 is theaforementioned photoradical polymerizable poly(meth)acrylate. Meanwhile,in order for the tackifier to achieve its adhesion imparting effect morestrongly, a material formed in advance by polymerizing the photoradicalpolymerizable poly(meth)acrylate can be contained. Examples of such apolymerized material can include copolymers of butyl acrylate, 2-hexylacrylate and acrylic acid, and copolymers of cyclohexyl acrylate andmethacrylic acid.

The constituting components of the photo-curable resin composition 3 areas described above. Meanwhile, it is preferred that the photo-curableresin composition 3 include the following components determined byreconsidering the entire constitution while giving particular attentionto a plasticizer component. This constitution is applied preferably tothe case where a light-shielding plate to shield a UV ray or anattenuation plate to attenuate a UV ray is arranged between a UV sourceand the applied photo-curable resin composition during UV radiation (seeFIGS. 3A to 3G and 4A to 4F).

The photo-curable resin composition 3 of a preferred constitutionsuitable for the aforementioned case contains the following components(I) to (IV):

<Component (I)> an acrylate-based oligomer component selected from thegroup consisting of a polyisoprene-based (meth)acrylate oligomer, apolybutadiene-based (meth)acrylate oligomer, and a polyurethane-based(meth)acrylate oligomer;

<Component (II)> an acrylic monomer component;

<Component (III)> a plasticizer component; and

<Component (IV)> a photopolymerization initiator component;

the total amount of the components (I) and (II) contained in thephoto-curable resin composition is from 25 to 80% by mass; the amount ofthe component (III) contained in the photo-curable resin composition isfrom 65 to 10% by mass; the component (III) contains a solid tackifier(1) having a softening point of from 60 to 150° C., and a liquid plasticcomponent (2); and the mass ratio between the tackifier (1) and theliquid plastic component (2) falls within a range of 60 to 30:30 to 10.These constituting components are described in detail below.

<Component (I)>

The photo-curable resin composition of the present invention contains anacrylic oligomer component (component (I)) as a photoradicalpolymerization component in order for a cured material to maintain itsproperties as a film. In the present invention, at least one typeselected from the group consisting of a polyisoprene-based(meth)acrylate oligomer having a polyisoprene skeleton in a main chain,a polybutadiene-based (meth)acrylate oligomer having a polybutadieneskeleton in a main chain, and a polyurethane-based (meth)acrylateoligomer having a polyurethane skeleton in a main chain, is applicableas the aforementioned acrylic oligomer component.

The polyisoprene-based (meth)acrylate oligomer can be one having amolecular weight of preferably from 1,000 to 100,000 as determined byGPC measurement. Specific and preferred examples thereof can includethose already described.

The polyurethane-based (meth)acrylate oligomer can be one having amolecular weight of preferably from 1,000 to 100,000 as determined byGPC measurement. Specific and preferred examples thereof can includethose already described.

The polybutadiene-based (meth)acrylate based oligomer can be one havinga molecular weight of preferably from 1,000 to 100,000 as determined byGPC measurement. Publicly known oligomers are applicable as thepolybutadiene based (meth)acrylate oligomer.

<Component (II)>

The photo-curable resin composition of the present invention contains aphotoradical polymerizable acrylic monomer component (component II)functioning as a reactive diluent. Specific and preferred examples ofthe acrylic monomer component can include 2-hydroxypropyl(meth)acrylate,benzyl acrylate, and dicyclopentenyloxyethyl(meth)acrylate alreadydescribed, and additionally, isobornyl(meth)acrylate andoctyl(meth)acrylate.

The total amount of the components (I) and (II) added in thephoto-curable resin composition, if it is too small, reduces theproperties of a cured material as a film, so that it tends to become acause of slip after adhesion. The total amount, if it is too large,generates excessive curing, so that it tends to become a cause ofdeformation of a member. Thus, in order to achieve the effect of thepresent invention, the total amount is from 25 to 85% by mass, andpreferably from 30 to 40% by mass. Regarding the mass ratio between thecomponents (I) and (II), an excessively increased relative mass of thecomponent (I) tends to reduce the interfacial strength of the curedmaterial. Conversely, an excessively reduced relative mass of thecomponent (I) tends to be brittle as the properties of the curedmaterial as a film. Thus, in order to achieve the effect of the presentinvention, the aforementioned mass ratio is preferably from 1:0.5 to1:3, and more preferably from 1:1 to 1:2.

<Component (III)>

The photo-curable resin composition of the present invention contains aplasticizer component (component (III)) having compatibility with theacrylic oligomer component being the component (I) and which is alsousable as a tackifier. If not having compatibility with the acrylicoligomer component being the component (I), the plasticizer componentmakes a cured material cloudy to generate the fear of reduction invisibility. Such a plasticizer component contains the solid tackifier(1) and the liquid plastic component (2). The term “solid” mentionedherein means that a softening point is from 60 to 150° C., preferablyfrom 80 to 120° C. according to JIS K5601-2-2. Being liquid means astate exhibiting a viscosity of from 0.01 to 100 Pa·s (25° C.) asmeasured with a cone-plate rheometer under atmospheric pressure and at25° C.

The solid tackifier (1) having the aforementioned softening point itselfis not photo-cured by UV irradiation. The solid tackifier (1) acts toincrease the initial adhesive strength (what is called tackiness) of acured resin layer or a pre-cured resin layer formed of the photo-curableresin composition, and to increase the eventual adhesive strength of acured resin layer formed by further curing the pre-cured resin layercompletely. Specific examples of the applicable tackifier (1) used caninclude terpene-based resins such as terpene resins, terpene phenolresins, and terpene hydrogenated resins; rosin resins such as naturalrosin, polymerized rosin, rosin ester, and hydrogenated rosin; andpetroleum resins such as polybutadiene and polyisoprene. Further, amaterial prepared in advance by polymerizing the acrylic oligomercomponent being the component (I) or the acrylate-based monomercomponent being the component (II) to have a molecular weight ofpreferably from about 1,000 to about 50,000 can be added within a rangenot impairing the effect of the present invention. Examples of thispolymerized material may include copolymers of butyl acrylate, 2-hexylacrylate and acrylic acid, and copolymers of cyclohexyl acrylate andmethacrylic acid.

The liquid plastic component (2) itself is not photo-cured by UVirradiation. The liquid plastic component (2) imparts flexibility to acured resin layer or a pre-cured resin layer after photo-curing, andreduces a cure shrinkage between cured resin layers or that of thepre-cured resin layer. The liquid plastic component (2) can be at leastone type selected from the group consisting of a liquidpolybutadiene-based plasticizer, a polyisoprene-based plasticizer, aphthalate-based plasticizer, and an adipate-based plasticizer.

The mass ratio between the tackifier (1) and the liquid plasticcomponent (2) in the plasticizer component being the component (III)falls within a range of 60 to 30:30 to 10, and preferably, of 60 to40:20 to 10. In the present invention, if the amount of the solidtackifier (1) is greater than that of the liquid plastic component (2),and particularly if it is within this range, the shape maintainingproperties of a cured resin layer after photo-curing and the propertiesthereof to maintain its adhesive strength can be enhanced.

Generally, a liquid plastic component is contained in a large amount inorder to reduce the cure shrinkage of a curable resin composition. Inthe case of the manufacturing method of the present invention, thecurable resin composition is irradiated with a UV ray before it isbonded to an image display member. This advantageously preventsgeneration of a large cure shrinkage, even if the curable resincomposition is photo-cured thereafter. To be specific, the process ofthe present invention can reduce a cure shrinkage. This can reduce aratio of the liquid plastic component as compared to a conventionalratio, so that the solid tackifier can be mixed in a larger amount.

The softening point of the tackifier (1) generally has correlation withthe molecular weight of the tackifier. Thus, if the tackifier (1)exhibiting a softening point of from 60 to 115° C. among the tackifiers(1) exhibiting a softening point of from 60 to 150° C. is used, the massratio between the tackifier (1) and the liquid plastic component (2) ispreferably determined to fall within a range of 60 to 40:20 to 10, andmore preferably a range of 60 to 50:20 to 10. If a tackifier exhibitinga softening point of from 115 to 150° C. is used, the mass ratio betweenthe tackifier (1) and the liquid plastic component (2) is preferablydetermined to fall within a range of 50 to 30:30 to 20, and morepreferably 50 to 40:30 to 20.

The amount of the plasticizer component being the component (III)contained in the photo-curable resin composition, if it is too little,leads to poor adhesion to tend to generate a failure such asdelamination. If it is too much, the resistance to heat of a curedmaterial degrades, generating the fear of a failure such as meltingunder heat environment. In order to achieve the effect of the presentinvention, the amount of the plasticizer component is from 65 to 10% bymass, and preferably from 60 to 30% by mass.

<Component (IV)>

The photo-curable resin composition of the present invention contains aphotopolymerization initiator component (component (IV)) forphotoradically polymerizing photopolymerizable components such as thecomponents (I) and (II).

A publicly known photoradical polymerization initiator is applicable asthe photopolymerization initiator being the component (IV), and examplesthereof can include those already described.

The amount of the photopolymerization initiator being the component (IV)added in the photo-curable resin composition, if it is too little,results in insufficient curing at the time of UV irradiation. If it istoo much, output gas is increased due to cleavage to tend to suffer afoaming failure. Thus, the amount of the photopolymerization initiatoris preferably from 0.1 to 5 parts by mass, and more preferably from 0.2to 3 parts by mass relative to 100 parts by mass of a total of theacrylate-based oligomer being the component (I) and the acrylic monomercomponent being the component (II).

The photo-curable resin composition of the present invention can containvarious additives in addition to the aforementioned components (I) to(IV) within a range not impairing the effect of the present invention.As an example, a chain transfer agent similar to that already describedcan be mixed for control of the molecular weight of the cured resin.Examples of the chain transfer agent can include those alreadydescribed. Additionally, general additives such as an adhesion promotersuch as a silane coupling agent, and an antioxidant can be contained,where appropriate.

The photo-curable resin composition of the constitution determined whilegiving particular attention to the plasticizer can be prepared byhomogeneously mixing the aforementioned components (I) to (IV) and anadditive of each type to be added, where appropriate, according to apublicly known mixing technique.

<Step (B) (Pre-Curing Step)>

Next, as shown in FIG. 1C, the photo-curable resin composition 3 appliedin the step (A) is irradiated with a UV ray to be pre-cured, therebyforming a pre-cured resin layer 5. Here, the pre-curing is performed totransfer the photo-curable resin composition 3 from a liquid state to astate where it does not flow remarkably. Thus, the photo-curable resincomposition 3 does not drop even if it is turned upside down as shown inFIG. 1D, thereby enhancing handling of the photo-curable resincomposition 3. This pre-curing can sufficiently photo-cure alight-transmitting cured resin layer between the light-shielding layer 1and an image display member without being eliminated from therebetween.This can also reduce cure shrinkage. This pre-curing is at a level thatmakes the cure rate (gel fraction) of the pre-cured resin layer 5preferably from 10 to 80%, and more preferably from 30 to 60%.

The cure rate (gel fraction) mentioned herein is a numerical valuedefined as a ratio (consumption ratio) of the abundance of a(meth)acryloyl group in the photo-curable resin composition 3 after UVirradiation relative to that of the (meth)acryloyl group before the UVirradiation. Increase of this numerical value shows curing proceedsfurther.

The cure rate (gel fraction) can be calculated by substituting anabsorption peak height (X) at from 1640 to 1620 cm⁻¹ above a baseline ofan FT-IR measurement chart about a resin composition layer before UVirradiation and an absorption peak height (Y) at from 1640 to 1620 cm⁻¹above a baseline of an FT-IR measurement chart about the resincomposition layer after the UV irradiation into the following formula(1).

[Formula 1]

Cure rate (%)={(X−Y)/X}×100  (1)

Regarding UV irradiation, the type of a light source, output, theaccumulated amount of light and the like are not specifically limited aslong as the pre-curing can proceed such that the cure rate (gelfraction) becomes preferably from 10 to 80%. Publicly known conditionsfor photoradical polymerization process on (meth)acrylate by UVirradiation are applicable.

Regarding conditions for UV irradiation, it is preferred that conditionsbe selected within the aforementioned range of the cure rate that do notgenerate dripping or deformation of the pre-cured resin layer duringbonding operation in the step (C) described later. If expressed in termsof a viscosity, such conditions not generating dripping or deformationare preferably 20 Pa·s or more (as measured with a cone-plate rheometerat 25° C., with a cone/plate C35/2 and a number of revolutions of 10rpm). The viscosity may be less than 20 Pa·s if the pre-cured resinlayer 5 is not turned upside down.

Regarding the conditions for UV irradiation, it is preferred thatconditions be selected within the aforementioned range of the cure ratethat can maintain stickiness (tackiness) of a surface of the pre-curedresin layer 5 during the bonding operation in the step (C) describedlater. If expressed in terms of a measured numerical value obtained by aprobe tack method (RHESCA method: a method of placing a sample with anadhesive side thereof facing up, pressing a probe against the adhesiveside from above, and peeling the probe) using a tacking tester(TAC-1000, available from RHESCA CO., LTD.), such conditions capable ofmaintaining stickiness are 30 N/cm² or more. (See “Method of measuringphysical properties of adhesive material” inhttp://www.rhesca.co.jp/main/technical/technical.html.)

<Step (C) (Bonding Step)>

Next, as shown in FIG. 1E, the light-transmitting cover member 2 isbonded to the image display member 6 from a side thereof on which thepre-cured resin layer 5 is formed. This bonding can be performed byapplying pressure at from 10° C. to 80° C. by using a publicly knownpressure bonding device.

<Step (D) Complete Curing Step)>

Next, as shown in FIG. 1F, the pre-cured resin layer 5 held between theimage display member 6 and the light-transmitting cover member 2 isirradiated with a UV ray to be completely cured. If necessary, thepre-cured resin layer 5 between the light-shielding layer 1 of thelight-transmitting cover member 2 and the image display member 6 may beirradiated with a UV ray to be completely cured. As a result, the imagedisplay member 6 and the light-transmitting cover member 2 are stackedvia a light-transmitting cured resin layer 7, thereby obtaining an imagedisplay device 10 (FIG. 1G).

Examples of the image display member 6 can include a liquid crystaldisplay panel, an organic EL display panel, a plasma display panel, anda touch panel. The touch panel mentioned herein means an image displayand input panel corresponding to a combination of a display element suchas a liquid crystal display panel and a position input device such as atouch pad.

The complete curing performed in this step is intended to cure thepre-cured resin layer 5 sufficiently to bond and stack the image displaymember 6 and the light-transmitting cover member 2. This complete curingis at a level that makes the cure rate (gel fraction) of thelight-transmitting cured resin layer 7 preferably 90% or more, and morepreferably 95% or more.

The light-transmitting level of the light-transmitting cured resin layer7 is required only to allow an image formed on the image display member6 to be recognized visually.

In the example described above by referring to FIGS. 1A to 1G, thephoto-curable resin composition is applied to the light-shielding layerforming surface of the light-transmitting cover member. In an exampledescribed below by referring to FIGS. 2A to 2F, the photo-curable resincomposition is applied to a surface of the image display member.Reference numbers common between FIGS. 1A to 1G and 2A to 2F representthe same constituting elements.

<Step (AA) (Application Step)>

First, as shown in FIG. 2A, a photo-curable resin composition 3 isapplied to a surface of an image display member 6 to be flattened. Atthis time, the photo-curable resin composition 3 is applied to athickness, preferably from 1.2 times to 50 times, more preferably fromtwice to 30 times, and further preferably from 2.5 to 4 times that of alight-shielding layer so as to cancel a step formed between thelight-shielding layer and a light-shielding layer forming surface of alight-transmitting cover member in a step (CC) described below.

The photo-curable resin composition 3 may be applied several times so asto obtain a required thickness.

<Step (BB) (Pre-Curing Step)>

Next, as shown in FIG. 2B, the photo-curable resin composition 3 appliedin the step (AA) is irradiated with a UV ray to be pre-cured, therebyforming a pre-cured resin layer 5 (FIG. 2C). Here, the pre-curing isperformed to transfer the photo-curable resin composition 3 from aliquid state to a state where it does not flow remarkably, therebyenhancing handling of the photo-curable resin composition 3. Thepre-curing is also performed to depress the photo-curable resincomposition 3 to an extent that can cancel the step of thelight-shielding layer when the light-shielding layer of thelight-transmitting cover member is placed from above. This pre-curingcan sufficiently photo-cure a light-transmitting cured resin layerbetween the light-shielding layer and the image display member withouteliminating the resin layer from therebetween, and can also suppresscure shrinkage. This pre-curing is at a level that makes the cure rate(gel fraction) of the pre-cured resin layer 5 preferably from 10 to 80%,and more preferably from 30 to 60%.

<Step (CC) (Bonding Step)>

Next, as shown in FIG. 2D, a light-transmitting cover member 2 is bondedto the pre-cured resin layer 5 on the image display member 6 from a sidethereof on which the light-shielding layer 1 is formed. This bonding canbe performed by applying pressure at from 10° C. to 80° C. by using apublicly known pressure bonding device.

<Step (DD) Complete Curing Step)>

Next, as shown in FIG. 2E, the pre-cured resin layer 5 held between theimage display member 6 and the light-transmitting cover member 2 isirradiated with a UV ray to be completely cured. If necessary, thepre-cured resin layer 5 between the light-shielding layer 1 of thelight-transmitting cover member 2 and the image display member 6 may beirradiated with a UV ray to be completely cured. As a result, the imagedisplay member 6 and the light-transmitting cover member 2 are stackedvia a light-transmitting cured resin layer 7, thereby obtaining an imagedisplay device 10 (FIG. 2F).

Examples of the image display member 6 can include a liquid crystaldisplay panel, an organic EL display panel, a plasma display panel, anda touch panel.

The complete curing performed in this step is at a level that makes thecure rate (gel fraction) of the light-transmitting cured resin layer 7preferably 90% or more, and more preferably 95% or more.

The light-transmitting level of the light-transmitting cured resin layer7 is required only to allow an image formed on the image display member6 to be recognized visually.

In the examples described above by referring to FIGS. 1A to 1G and FIGS.2A to 2F, the photo-curable resin composition is applied to thelight-shielding layer forming surface of the light-transmitting covermember or the surface of the image display member, and the appliedphoto-curable resin composition is entirely irradiated with a UV ray tobe pre-cured. In examples described below by referring to FIGS. 3A to 3Gand FIGS. 4A to 4F, a UV ray is applied while a shielding plate or anattenuation plate to shield or attenuate a UV ray is arranged between aUV source and the applied photo-curable resin composition. Referencenumbers common between these drawings represent the same constitutingelements.

An aspect of FIGS. 3A to 3G will be described first. In this aspect, aphoto-curable resin composition is applied to a surface of alight-transmitting cover member.

<Step (a) (Application Step)>

First, as shown in FIG. 3A, a light-transmitting cover member 2 having alight-shielding layer 1 formed on a peripheral part of one surfacethereof is prepared. Then, as shown in FIG. 3B, a liquid photo-curableresin composition 3 is applied to a light-shielding layer formingsurface 2 a of the light-transmitting cover member 2 to a thicknessgreater than that of the light-shielding layer 1 so as to cancel a step4 formed between the light-shielding layer 1 and the light-shieldinglayer forming surface 2 a of the light-transmitting cover member 2. Morespecifically, the photo-curable resin composition 3 is applied on theentire light-shielding layer forming surface 2 a of thelight-transmitting cover member 2 including a surface of thelight-shielding layer 1 to be flattened so as to avoid generation of astep. Thus, the photo-curable resin composition 3 is applied to athickness, preferably from 1.2 to 12.5 times, and more preferably from2.5 to 4 times that of the light-shielding layer 1.

The photo-curable resin composition 3 may be applied several times so asto obtain a required thickness.

<Step (b) (Pre-Curing Step)>

Next, as shown in FIG. 3C, at least part of the photo-curable resincomposition 3 existing on the light-shielding layer 1 is irradiated witha UV ray to be pre-cured, so that the cure rate of a pre-cured resinlayer 5 a on the light-shielding layer 1 can be increased. Here, atleast the part of the photo-curable resin composition 3 existing on thelight-shielding layer 1 is pre-cured while it is transferred from aliquid state to a state where it does not flow remarkably. This isbecause the drop of the photo-curable resin composition 3 is preventedeven if it is turned upside down as shown in FIG. 3D to enhance handlingof the photo-curable resin composition 3, and at the same time, the stepbetween the light-shielding layer 1 and the light-shielding layerforming surface of the light-transmitting cover member 2 is cancelled.Pre-curing the outer periphery of the applied region is also intended tomaintain the shape of application, thereby enhancing a cured state inadvance above the light-shielding layer 1 where UV irradiation isdifficult.

As shown in FIG. 3C, this pre-curing can be realized by disposing,between a UV source and the applied photo-curable resin composition 3,an attenuation plate 20 to attenuate a UV ray and then applying a UVray. Examples of the attenuation plate 20 can include a quartz platemember with fine concave and convex portions formed on a surfacethereof. A UV ray to enter the attenuation plate 20 first reflectsdiffusely at the surface concave and convex portions, and thenattenuates inside the plate member. The level of the surface concave andconvex portions is required only to have a size or a shape thatgenerates diffused reflection.

The pre-curing can also be performed with a shielding plate to shieldlight instead of the attenuation plate 20. In this case, a peripheralpart of a panel may be exposed while a main surface part of the panelmay be shielded by the shielding plate. The shielding plate may bedisposed in a partial period within a duration of UV′ irradiation.

The cure rate (gel fraction) of the pre-cured resin layer 5 a on thelight-shielding layer 1 is set to a level of preferably from 30 to 80%,and more preferably from 40 to 70%. This can completely cure alight-transmitting cured resin layer 7 on the light-shielding layer 1when the light-transmitting cured resin layer 7 on thelight-transmitting cover member 2 corresponding to the main surface partof the panel is completely cured in a complete curing step correspondingto a step (d) described later. The complete curing mentioned hereinmeans a cured state of the cure rate being at least 90% as describedabove.

The cure rate (gel fraction) of the pre-cured resin layer 5 b on thesurface of the light-transmitting cover member 2 is preferably from 0 to80%, and more preferably from 20 to 70%. The cure rate of the pre-curedresin layer exceeding 80% tends to generate interfacial delaminationeasily to worsen an adhesive state.

In order for the resin composition not to be eliminated from between thelight-shielding layer 1 and the light-transmitting cover member 2, it ispreferred that the cure rate of the pre-cured resin layer 5 a on thelight-shielding layer 1 be higher than that of the pro-cured resin layer5 b on the surface of the light-transmitting cover member 2.

The cure rate (gel fraction) can be calculated in the manner alreadydescribed. Conditions for UV irradiation, the viscosity, tackiness andthe like of the pre-cured resin, can be the same as those alreadydescribed.

<Step (c) (Bonding Step)>

Next, as shown in FIG. 3E, the light-transmitting cover member 2 isbonded to the image display member 6 from a side thereof on which thepre-cured resin layer 5 is formed. This bonding can be performed byapplying pressure at from 10° C. to 80° C. by using a publicly knownpressure bonding device.

<Step (d) Complete Curing Step)>

Next, as shown in FIG. 3F, the pre-cured resin layer 5 held between theimage display member 6 and the light-transmitting cover member 2 isirradiated with a UV ray to be completely cured. If necessary, thepre-cured resin layer 5 between the light-shielding layer 1 of thelight-transmitting cover member 2 and the image display member 6 may beirradiated with a UV ray to be completely cured. As a result, the imagedisplay member 6 and the light-transmitting cover member 2 are stackedvia the light-transmitting cured resin layer 7, thereby obtaining animage display device 10 (FIG. 3G).

Examples of the image display member 6 can include a liquid crystaldisplay panel, an organic EL display panel, a plasma display panel, anda touch panel. The touch panel mentioned herein means an image displayand input panel corresponding to a combination of a display element suchas a liquid crystal display panel and a position input device such as atouch pad.

The complete curing performed in this step is intended to cure thepre-cured resin layer 5 sufficiently to bond and stack the image displaymember 6 and the light-transmitting cover member 2. This complete curingis at a level that makes the cure rate (gel fraction) of thelight-transmitting cured resin layer 7 preferably 90% or more, and morepreferably 95% or more.

The light-transmitting level of the light-transmitting cured resin layer7 is required only to allow an image formed on the image display member6 to be recognized visually.

An aspect of FIGS. 4A to 4F will be described first. In this aspect, aphoto-curable resin composition is applied to a surface of an imagedisplay member.

<Step (aa) (Application Step)>

First, as shown in FIG. 4A, a photo-curable resin composition 3 isapplied to be flattened on a surface of an image display member 6. Atthis time, the photo-curable resin composition 3 is applied to athickness, preferably from 1.2 to 12.5 times, and more preferably from2.5 to 4 times that of a light-shielding layer so as to cancel a stepformed between the light-shielding layer and a light-shielding layerforming surface of a light-transmitting cover member in a step (cc)described below.

The photo-curable resin composition 3 may be applied several times so asto obtain a required thickness.

<Step (bb) (Pre-Curing Step)>

Next, as shown in FIG. 4B, at least part of the photo-curable resincomposition 3 existing on the light-shielding layer 1 is irradiated witha UV ray to be pre-cured, thereby forming a pre-cured resin layer 5 a(FIG. 4C). Here, at least the part of the photo-curable resincomposition 3 existing on the light-shielding layer 1 is pre-cured whileit is transferred from a liquid state to a state where it does not flowremarkably. This is because a step between the light-shielding layer 1and the light-shielding layer forming surface of the light-transmittingcover member 2 is cancelled. Pre-curing the outer periphery of theapplied region is also intended to maintain the shape of application,thereby enhancing a cured state in advance above the light-shieldinglayer 1 where UV irradiation is difficult.

As shown in FIG. 4B, this pre-curing can be realized by providing anattenuation plate 20 to attenuate a UV ray between a UV source and theapplied photo-curable resin composition 3 and then applying a UV ray. Ashielding plate to shield light can replace the attenuation plate 20. Inthis case, a peripheral part of a panel may be exposed while a mainsurface part of the panel may be shielded by the shielding plate. Theshielding plate may be arranged in a partial period within a duration ofUV irradiation.

The cure rate (gel fraction) of the pre-cured resin layer 5 a on thelight-shielding layer 1 is at a level of preferably from 30 to 80%, andmore preferably from 40 to 70%. This can completely cure alight-transmitting cured resin layer 7 on the light-shielding layer 1when the light-transmitting cured resin layer 7 on thelight-transmitting cover member 2 corresponding to the main surface partof the panel is completely cured in a complete curing step correspondingto a step (dd) described later. The complete curing mentioned hereinmeans a cured state of the cure rate being at least 90% as describedabove.

The cure rate (gel fraction) of the pre-cured resin layer 5 b on thesurface of the light-transmitting cover member 2 is preferably from 0 to80%, and more preferably from 20 to 70%. The cure rate of the pre-curedresin layer exceeding 80% tends to generate interfacial delaminationeasily to worsen an adhesive state.

In order for the resin composition not to be eliminated from between thelight-shielding layer 1 and the light-transmitting cover member 2, it ispreferred that the cure rate of the pre-cured resin layer 5 a on thelight-shielding layer 1 be higher than that of the pre-cured resin layer5 b on the surface of the light-transmitting cover member 2.

The cure rate (gel fraction) can be calculated in the manner alreadydescribed. Conditions for UV irradiation, the viscosity, tackiness andthe like of the pre-cured resin, can be the same as those alreadydescribed.

<Step (cc) (Bonding Step)>

Next, as shown in FIG. 4D, the light-transmitting cover member 2 isbonded to the image display member 6 from a side thereof on which thepre-cured resin layer 5 is formed. This bonding can be performed byapplying pressure at from 10° C. to 80° C. by using a publicly knownpressure bonding device.

<Step (dd) Complete Curing Step)>

Next, as shown in FIG. 4E, the pre-cured resin layer 5 held between theimage display member 6 and the light-transmitting cover member 2 isirradiated with a UV ray to be completely cured. If necessary, thepre-cured resin layer 5 between the light-shielding layer 1 of thelight-transmitting cover member 2 and the image display member 6 may beirradiated with a UV ray to be completely cured. As a result, the imagedisplay member 6 and the light-transmitting cover member 2 are stackedvia the light-transmitting cured resin layer 7, thereby obtaining animage display device 10 (FIG. 4F).

Examples of the image display member 6 can include a liquid crystaldisplay panel, an organic EL display panel, a plasma display panel, anda touch panel. The touch panel mentioned herein means an image displayand input panel corresponding to a combination of a display element suchas a liquid crystal display panel and a position input device such as atouch pad.

The complete curing performed in this step is intended to cure thepre-cured resin layer 5 sufficiently to bond and stack the image displaymember 6 and the light-transmitting cover member 2. This complete curingis at a level that makes the cure rate (gel fraction) of thelight-transmitting cured resin layer 7 preferably 90% or more, and morepreferably 95% or more.

The light-transmitting level of the light-transmitting cured resin layer7 is required only to allow an image formed on the image display member6 to be recognized visually.

As described above, according to the manufacturing method of the presentinvention, a liquid photo-curable resin composition is applied to asurface of a light-transmitting cover member including a light-shieldinglayer or a surface of an image display member to a thickness greaterthan that of the light-shielding layer. Then, the photo-curable resincomposition is irradiated with a UV ray to be pre-cured, thereby forminga pre-cured resin layer at least on the light-shielding layer. Next, theimage display member and the light-transmitting cover member are stackedvia the pre-cured resin layer and thereafter, the pre-cured resin layeris irradiated with a UV ray to be completely cured, thereby forming alight-transmitting cured resin layer. Thus, even without performing heatpolymerization process, the light-transmitting cured resin layer betweenthe light-shielding layer and the image display member is photo-curedsufficiently without being eliminated from therebetween irrespective ofwhether the light-transmitting cured resin layer exists on thelight-shielding layer or the surface of the light-transmitting covermember. Further, a step between the light-shielding layer and alight-shielding layer forming surface of the light-transmitting covermember can be canceled.

EXAMPLES

The present invention will be described in more detail below by means ofExamples of the present invention.

Example 1 Step (A) (Application Step)

First, a glass plate of a size of 45 mm (w)×80 mm (l)×0.4 mm (t) wasprepared. Next, a light-shielding layer of a width of 4 mm was appliedto a thickness of 40 μm in a dry state to the entire peripheral part ofthe glass plate by screen printing process using a thermosetting blackink (MRX ink, available from Teikoku Printing Inks Mfg. Co., Ltd.) andthen dried, thereby preparing a glass plate with a light-shieldinglayer.

Next, a photo-curable resin composition was prepared by homogeneouslymixing 6 parts by mass of polyisoprene methacrylate (UC102, availablefrom KURARAY CO., LTD.) as a photoradical polymerizablepoly(meth)acrylate, 15 parts by mass of dicyclopentenyloxyethylmethacrylate and 5 parts by mass of lauryl methacrylate as a reactivediluent, 20 parts by mass of polybutadiene (Polyvest 110, available fromEvonik Degussa GmbH) as a plasticizer, 1 part by mass of aphotopolymerization initiator (Irgacure 184, available from BASF), and53 parts by mass of a hydrogenated terpene resin (Clearon M105,available from YASUHARA CHEMICAL CO., LTD.) as a tackifier. Theviscosity of the photo-curable resin composition was about 6,000 mPa·s(as measured with a cone-plate rheometer at 25° C., with a cone/plateC35/2 and a number of revolutions of 10 rpm).

Next, the photo-curable resin composition was discharged with a resindispenser on the entire light-shielding layer forming surface of theglass plate with a light-shielding layer, thereby forming aphoto-curable resin composition film of an average of about 200 μm. Asshown in FIG. 1B, the photo-curable resin composition film was formed tocover the substantially entire light-shielding layer, and was formed tobe greater in thickness by about 160 μm than the light-shielding layerof a thickness of 40 μm.

Step (B) (Pre-Curing Step)

Next, the photo-curable resin composition film was irradiated with a UVray of an intensity of 50 mW/cm² for six seconds by using a UVirradiation device (LC-8, available from Hamamatsu Photonics K.K.) so asto achieve an integrated light quantity of 300 mJ/cm², therebypre-curing the photo-curable resin composition film to form a pre-curedresin layer. The integrated light quantity of 300 mJ/cm² mentionedherein corresponds to about 10% of the quantity of a UV ray required forcompletely curing the photo-curable resin composition film.

The cure rate of the photo-curable resin composition film after the UVirradiation, specifically of the pre-cured resin layer, was determinedby using, as an index, an absorption peak height at from 1640 to 1620cm⁻¹ above a baseline of an FT-IR measurement chart, and was about 50%.

The viscosity of the pre-cured resin layer was 30 Pa·s (as measured witha cone-plate rheometer at 25° C., with a cone/plate C35/2 and a numberof revolutions of 10 rpm). Thus, inverting the glass plate to place thepre-cured resin layer of the glass plate downside did not generatedripping or deformation within one minute.

Further, the tackiness of a surface of the pre-cured resin layer wasmeasured by the probe tack method using a tacking tester (TAC-II,available from RHESCA CO., LTD.), and was 90 N/cm².

Step (C) (Bonding Step)

Next, the glass plate obtained in the step (B) was placed on a surfaceof a liquid crystal display element of a size of 40 mm (W)×70 mm (L) onwhich a polarizing plate was stacked such that a side of the glass platewith the pre-cured resin layer faced the polarizing plate. Then,pressure was applied with a rubber roller from the side of the glassplate to bond the glass plate. The liquid crystal display element wasvisually observed from the side of the glass plate while the glass platewas bonded. As a result, air bubbles were not observed around thelight-shielding layer.

Step (D) (Complete Curing Step)

Next, the liquid crystal display element was irradiated with a UV ray(50 mW/cm²) for 60 seconds from the side of the glass plate by using aUV irradiation device (LC-8, available from Hamamatsu Photonics K.K.) tocompletely cure the pre-cured resin layer, thereby forming alight-transmitting cured resin layer. The cure rate of thelight-transmitting cured resin layer was 97%. As a result, a liquidcrystal display device was obtained where the glass plate as alight-transmitting cover member was stacked on the liquid crystaldisplay element via the light-transmitting cured resin layer.

<Evaluations>

The presence or absence of air bubbles at a boundary of thelight-shielding layer with the photo-curable resin composition film, thepre-cured resin layer or the light-transmitting cured resin layer in aresultant in each step of Example 1 was observed visually in a mannerdescribed below. Further, the adhesive state of the liquid crystaldisplay device was evaluated in a manner described below. Results ofExamples 1 to 5 and Comparative Examples 1 to 5 are summarized in Table1.

(Presence or Absence of Air Bubbles)

The presence or absence of air bubbles at the boundary of thelight-shielding layer with the photo-curable resin composition film, thepre-cured resin layer or the light-transmitting cured resin layer in theresultant in each step was observed visually. As a result, air bubbleswere not observed in the resultants in all the steps and the finishedliquid crystal display device.

(Evaluation of Adhesive State)

As shown in FIG. 5, during formation of the liquid crystal displaydevice, a bonded glass structure was obtained by using a glass base 30of a size of 40 mm (W)×70 mm (L) in place of the liquid crystal displayelement, and bonding a glass plate 31 including a pre-cured resin layerformed thereon to the glass base 30 at right angles from a side thereofon which the pre-cured resin layer was formed. While the glass base 30placed below the glass plate 31 was fixed, the glass plate 31 placedabove was peeled directly upward. Resultant delamination properties wereobserved visually and an adhesive state was evaluated according to thefollowing criteria. As a result, the adhesive state was evaluated as“A.”

Ranks Criteria

A: Cohesive delamination was generated.

B: Both cohesive delamination and interfacial delamination weregenerated.

C: Interfacial delamination was generated.

Example 2

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 1, except that the photo-curable resin composition film wasformed to cover about 70% of the width of the light-shielding layer inthe step (A) (application step) of Example 1. Then, the presence orabsence of air bubbles was observed, and an adhesive state wasevaluated. As a result, even if the photo-curable resin composition filmwas formed to cover only about 70% of the width of the light-shieldinglayer, air bubbles were not present in resultants in all the steps andthe finished liquid crystal display device of Example 2, and theadhesive state was evaluated as A. This is considered to be by virtue ofthe fact that the pre-cured resin layer expanded to cover the entirelight-shielding layer in the step (C) (bonding step).

Example 3

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 1, except that the photo-curable resin composition film wasformed to a thickness of about 1.2 times that of the light-shieldinglayer in the step (A) (application step) of Example 1. Then, thepresence or absence of air bubbles was observed, and an adhesive statewas evaluated. As a result, by forming the photo-curable resincomposition film to a thickness of about 1.2 times that of thelight-shielding layer, air bubbles were not present in resultants in allthe steps and the finished liquid crystal display device of Example 3,and the adhesive state was evaluated as “A.”

Example 4

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 1, except that a photo-curable resin composition 3 a was appliedto the same thickness as that of the light-shielding layer 1 not tocover the light-shielding layer 1 as shown in FIG. 6A, and thereafter aphoto-curable resin composition 3 b was applied to cover thelight-shielding layer 1 as shown in FIG. 6B in the step (A) (applicationstep) of Example 1. Then, the presence or absence of air bubbles wasobserved, and an adhesive state was evaluated. As a result, even if thephoto-curable resin composition has multiple layers, air bubbles werenot present in resultants in all the steps and the finished liquidcrystal display device of Example 4, and the adhesive state wasevaluated as “A.”

Example 6

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 1, except that the cure rate of the pre-cured resin layer wasset to be 10%, 30%, 60% and 80% in the step (B) of Example 1, and that aUV ray was irradiated until the cure rate of the pre-cured resin layerof 99% or more was achieved in the step (D). Then, the presence orabsence of air bubbles was observed, and an adhesive state wasevaluated. As a result, even if the cure rate of the pre-cured resinlayer changes in a range of from 10% to 80%, air bubbles were notpresent in resultants in all the steps and the finished liquid crystaldisplay device of Example 5. Further, the adhesive state was evaluatedas “A,” except for the case of 80% (evaluated as “B”).

The tackiness of a surface of the pre-cured resin layer was measured bythe probe tack method using a tacking tester (TAC-II, available fromRHESCA CO., LTD.), and was confirmed to fall within a range of from 30to 120 N/cm².

Comparative Example 1

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 1, except that the photo-curable resin composition 3 was formedto cover the entire light-shielding layer 1 while it was formed to athickness of about 30 μm smaller than that of the light-shielding layer1 in the step (A) (application step) of Example 1, as shown in FIG. 7.Then, the presence or absence of air bubbles was observed, and anadhesive state was evaluated. As a result, air bubbles were not observedin a resultant in the step (A), whereas air bubbles were observed in aresultant in the step (C) and a resultant in the step (D) (liquidcrystal display device). The adhesive state was evaluated as “A.”

Comparative Example 2

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 1, except that the photo-curable resin composition 3 was formedas dots to a height greater than that of the light-shielding layer 1 soas not to cover the light-shielding layer 1 in the step (A) (applicationstep) of Example 1, as shown in FIG. 8. Then, the presence or absence ofair bubbles was observed, and an adhesive state was evaluated. UVirradiation clearly catches air bubbles, so that the glass plate wasbonded to the liquid crystal display device without UV irradiation. As aresult, air bubbles were observed in every region not limited to thesurrounding of the light-shielding layer. The adhesive state wasevaluated as “A.”

Comparative Example 3

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 1, except that the photo-curable resin composition 3 was formednot to cover the light-shielding layer 1 and to a thickness smaller thanthat of the light-shielding layer 1 in the step (A) (application step)of Example 1, as shown in FIG. 9. Then, the presence or absence of airbubbles was observed, and an adhesive state was evaluated. As a result,air bubbles were not observed in a resultant in the step (A), whereasair bubbles were observed in a resultant in the bonding step of the step(C) and a resultant in the step (D) (complete curing step) (liquidcrystal display device). The adhesive state was evaluated as “A.”

Comparative Example 4

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 1, except that the cure rate of the pre-cured resin layer wasset to be 90% in the step (B) (pre-curing step) of Example 1, and that aUV ray was irradiated for 30 seconds in the step (D) (complete curingstep). Then, the presence or absence of air bubbles was observed, and anadhesive state was evaluated. As a result, air bubbles were not presentin resultants in all the steps, whereas the adhesive state was evaluatedas “C.”

Comparative Example 5

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 1, except that the photo-curable resin composition was notapplied to the glass plate but formed on a release film in the step (A)of Example 1, a pre-cured resin layer was formed from the photo-curableresin composition on the release film by the same UV irradiation as thatof the step (B) of Example 1, and the pre-cured resin layer wastransferred to a glass plate including a light-shielding layer formedthereon. Then, the presence or absence of air bubbles was observed, andan adhesive state was evaluated. As a result, air bubbles were observedat a step of the light-shielding layer during transfer of the pre-curedresin layer. Air bubbles were also observed in resultants in thesubsequent steps (C) and (D). The adhesive state was evaluated as “B.”

TABLE 1 EXAMPLE COMPARATIVE EXAMPLE 1 2 3 4 5 1 2 3 4 5 Presence orAbsent Absent Absent Absent Absent Present Present Present AbsentPresent Absence of Air Bubbles Evaluation of A A A A A A A A C BAdhesive State

Example 6 Step (a) (Application Step)

First, a glass plate of a size of 45 mm (w)×80 mm (l)×0.4 mm (t) wasprepared. Next, a light-shielding layer of a width of 4 mm was appliedto a thickness of 40 μm in a dry state to the entire peripheral part ofthe glass plate by screen printing process using a thermosetting blackink (MRX ink, available from Teikoku Printing Inks Mfg. Co., Ltd.) andthen dried, thereby preparing a glass plate with a light-shieldinglayer.

Next, a photo-curable resin composition was prepared by homogeneouslymixing 40 parts by mass of an acrylate-based oligomer having apolyisoprene skeleton (UC203, available from KURARAY CO., LTD.), 20parts by mass of dicyclopentenyloxyethyl methacrylate (FA512M, availablefrom Hitachi Chemical Co., Ltd.), 3 parts by mass of hydroxypropylmethacrylate (HPMA, available from Nippon Kasei Chemical Co., Ltd.), 15parts by mass of tetrahydrofurfryl acrylate (LIGHT ESTER THF, availablefrom KYOEISHA CHEMICAL Co., LTD.), 5 parts by mass of laurylmethacrylate (LIGHT ESTER L, available from KYOEISHA CHEMICAL Co.,LTD.), 20 parts by mass of a polybutadiene polymer (Polyvest 110,available from Evonik Degussa GmbH), 45 parts by mass of a hydrogenatedterpene resin (P85, available from YASUHARA CHEMICAL CO., LTD.), and 4parts by mass of a photopolymerization initiator (Irgacure 184,available from BASF). This photo-curable resin composition exhibited atotal cure shrinkage of 3.4% under a cure rate of from 0 to 90%. Theviscosity of the photo-curable resin composition was about 6,000 mPa·s(as measured with a cone-plate rheometer at 25° C., with a cone/plateC35/2 and a number of revolutions of 10 rpm).

Next, the photo-curable resin composition was discharged with a resindispenser on the entire light-shielding layer forming surface of theglass plate with a light-shielding layer, thereby forming aphoto-curable resin composition film of an average of about 200 μm. Asshown in FIG. 3B, the photo-curable resin composition film was formed tocover the substantially entire light-shielding layer, and was formed tobe greater in thickness by about 160 μm than the light-shielding layerof a thickness of 40 μm.

Step (b) (Pre-Curing Step)

Next, a shielding plate to shield a UV ray is disposed between a UVsource and the photo-curable resin composition. Then, the photo-curableresin composition film was pre-cured by using a UV irradiation device(LC-8, available from Hamamatsu Photonics K.K.), thereby forming apre-cured resin layer. The cure rate of the photo-curable resincomposition film after the UV irradiation, specifically of the pre-curedresin layer, was determined by using, as an index, an absorption peakheight at from 1640 to 1620 cm⁻¹ above a baseline of an FT-IRmeasurement chart, and was about 30% on the light-shielding layer andabout 0% on a surface of a light-transmitting cover member.

Step (c) (Bonding Step)

Next, the glass plate obtained in the step (b) was placed on a surfaceof a liquid crystal display element of a size of 40 mm (W)×70 mm (L) onwhich a polarizing plate was stacked such that a side of the glass platewith the pre-cured resin layer faced the polarizing plate. Then,pressure was applied with a rubber roller from the side of the glassplate to bond the glass plate. The liquid crystal display element wasvisually observed from the side of the glass plate while the glass platewas bonded. As a result, air bubbles were not observed around thelight-shielding layer.

Step (d) (Complete Curing Step)

Next, the liquid crystal display element was irradiated with a UV ray(50 mW/cm²) from the side of the glass plate by using a UV irradiationdevice (LC-8, available from Hamamatsu Photonics K.K.) to cure thephoto-curable resin composition on the light-transmitting cover memberto a cure rate of 95% or more, thereby forming a light-transmittingcured resin layer. The cure rate of the light-transmitting cured resinlayer on the light-shielding layer was about 90%. As a result, a liquidcrystal display device was obtained where the glass plate as thelight-transmitting cover member was stacked on the liquid crystaldisplay element via the light-transmitting cured resin layer.

<Evaluations>

As described below, the presence or absence of elimination of thephoto-curable resin composition from between the light-shielding layerand the image display member in each step of Example 6 was evaluated ina manner described below. Further, the adhesive state of the liquidcrystal display device was evaluated in a manner described below.Results of Examples 6 to 9 and Comparative Examples 6 and 7 aresummarized in Table 2.

(Presence or Absence of Elimination of Photo-Curable Resin Compositionfrom Between Light-Shielding Layer and Image Display Member)

The presence or absence of elimination of the photo-curable resincomposition from between the light-shielding layer and the image displaymember in a resultant in each step of Example 6 was observed visually.As a result, elimination of the photo-curable resin composition was notobserved in the resultants in all the steps and the finished liquidcrystal display device.

(Evaluation of Adhesive State)

As in Example 1, during formation of the liquid crystal display device,a bonded glass structure was obtained by using a glass base 30 of a sizeof 40 mm (W)×70 mm (L) in place of the liquid crystal display element,and bonding a glass plate 31 including a pre-cured resin layer formedthereon to the glass base 30 at right angles from a side thereof onwhich the pre-cured resin layer was formed, as shown in FIG. 5. Whilethe glass base 30 placed below the glass plate 31 was fixed, the glassplate 31 placed above was peeled directly upward. Resultant delaminationproperties were observed visually and an adhesive state was evaluatedaccording to the same criteria as those of Example 1. As a result, theadhesive state was evaluated as “A.”

Example 7

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 6, except that a UV ray was applied to make the cure rate of thepre-cured resin layer on the light-shielding layer about 50% in the step(b) (pre-curing step) of Example 6. As a result, the cure rate of thelight-transmitting cured resin layer on the light-shielding layer wasabout 95%, and elimination of the photo-curable resin composition wasnot observed in resultants in all the steps and the finished liquidcrystal display device. Further, the adhesive state was evaluated as“A.”

Example 8

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 6, except that a UV ray was applied to make the cure rate of thepre-cured resin layer on the light-shielding layer about 70% in the step(b) (pre-curing step) of Example 6. As a result, the cure rate of thelight-transmitting cured resin layer on the light-shielding layer wasabout 95%, and elimination of the photo-curable resin composition wasnot observed in resultants in all the steps and the finished liquidcrystal display device. Further, the adhesive state was evaluated as“A.”

Example 9

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 6, except that a UV ray was applied to make the cure rate of thepre-cured resin layer on the light-shielding layer about 80% in the step(b) (pre-curing step) of Example 6. As a result, the cure rate of thelight-transmitting cured resin layer on the light-shielding layer wasabout 95%, and elimination of the photo-curable resin composition wasnot observed in resultants of all the steps and the finished liquidcrystal display device. Further, the adhesive state was evaluated as“B.”

Comparative Example 6

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 6, except that a UV ray was applied to make the cure rate of thepre-cured resin layer on the light-shielding layer about 90% in the step(b) (pre-curing step) of Example 6. As a result, the cure rate of thelight-transmitting cured resin layer on the light-shielding layer wasabout 95%, and elimination of the photo-curable resin composition wasnot observed in resultants in all the steps and the finished liquidcrystal display device. Meanwhile, the adhesive state was evaluated as“C.”

Comparative Example 7

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 6, except that a UV ray was applied make the cure rate of thepre-cured resin layer on the light-shielding layer about 10% in the step(b) (pre-curing step) of Example 6. As a result, the cure rate of thelight-transmitting cured resin layer on the light-shielding layer wasabout 80%, and elimination of the photo-curable resin composition wasobserved in the step (d) (complete curing step). Meanwhile, the adhesivestate was evaluated as “A.”

TABLE 2 Comparative Example Example 6 7 8 9 6 7 Cure Rate of Pre-curedResin Position on Light- 30 50 70 80 90 10 Layer (%) shielding LayerPosition on Cover  0  0  0  0  0  0 Member Cure Rate of Cured ResinPosition on Light- 90 95 95 95 95 80 Layer (%) shielding Layer Positionon Cover   95≦   95≦   95≦   95≦   95≦   95≦ Member Presence or Absenceof Elimination of Absent Absent Absent Absent Absent PresentPhoto-curable Resin Composition Evaluation of Adhesive State A A A B C A

In the case of Comparative Example 6 shown in Table 2, interfacialdelamination was generated in the cured resin layer on thelight-shielding layer when the cure rate of the pre-cured resin layer onthe light-shielding layer was made to be about 90% in the step (b)(pre-curing step). Thus, the adhesive state was evaluated as “C.”

In the case of Comparative Example 7 shown in Table 2, complete curingof a cure rate of 90% or more could not be achieved on the entirelight-shielding layer and the entire light-transmitting cover member inthe step (d) (complete curing step) when the cure rate of the pre-curedresin layer on the light-shielding layer was made to be about 10% in thestep (b) (pre-curing step). Hence, elimination of the photo-curableresin composition was generated.

In contrast, in the cases of Examples 6 to 9, by making the cure rate ofthe pre-cured resin layer on the light-shielding layer from 30 to 80% inthe step (b) (pre-curing step), complete curing of a cure rate of 90% ormore could be achieved on the entire light-shielding layer and theentire light-transmitting cover member in the step (d) (complete curingstep). As a result, elimination of the photo-curable resin compositionwas not observed, and the adhesive state was evaluated as A or B.

Example 10

In the step (b) of Example 6, a quartz UV attenuation plate with fineconvex and concave portions formed on a surface thereof was arrangedinstead of the UV shielding plate between the UV source and thephoto-curable resin composition to expose a peripheral part of aprotective film to an incident UV ray and to limit incidence of the UVray at a main surface part of the panel with the attenuation plate.Further, a liquid crystal display device and a bonded glass structurefor adhesive strength measurement were formed in the same manner as inExample 6, except that a UV ray was applied to make the cure rate of thepre-cured resin layer on the light-shielding layer about 70% and that ofthe pre-cured resin layer on the surface of the light-transmitting covermember about 20%.

<Evaluations>

The presence or absence of elimination of the photo-curable resincomposition from between the light-shielding layer and the image displaymember, and the adhesive state of the liquid crystal display device ineach step of Example 10 were evaluated in the same manner as in Example6. As a result, the cure rate of the light-transmitting cured resinlayer on the light-shielding layer was about 95%, and elimination of thephoto-curable resin composition was not observed in resultants in allthe steps and the finished liquid crystal display device. Further, theadhesive state was evaluated as “A.” Results of Examples 10 to 13 andComparative Example 8 are summarized in Table 3.

Example 11

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 6, except that a UV ray was applied to make the cure rate of thepre-cured resin layer on the light-shielding layer about 70% and that ofthe pre-cured resin layer on the surface of the light-transmitting covermember about 40% in the step (b) of Example 10. As a result, the curerate of the light-transmitting cured resin layer on the light-shieldinglayer was about 95%, and elimination of the photo-curable resincomposition was not observed in resultants in all the steps and thefinished liquid crystal display device. Further, the adhesive state wasevaluated as “A.”

Example 12

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 6, except that a UV ray was applied to make the cure rate of thepre-cured resin layer on the light-shielding layer about 70% and that ofthe pre-cured resin layer on the surface of the light-transmitting covermember about 60% in the step (b) of Example 10. As a result, the curerate of the light-transmitting cured resin layer on the light-shieldinglayer was about 95%, and elimination of the photo-curable resincomposition was not observed in resultants in all the steps and thefinished liquid crystal display device. Further, the adhesive state wasevaluated as “B.”

Example 13

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 6, except that a UV ray was applied to make the cure rate of thepre-cured resin layer on the light-shielding layer about 70% and that ofthe pre-cured resin layer on the surface of the light-transmitting covermember about 80% in the step (b) of Example 10. As a result, the curerate of the light-transmitting cured resin layer on the light-shieldinglayer was about 95%, and elimination of the photo-curable resincomposition was not observed in resultants in all the steps and thefinished liquid crystal display device. Further, the adhesive state wasevaluated as “B.”

Comparative Example 8

A liquid crystal display device and a bonded glass structure foradhesive strength measurement were formed in the same manner as inExample 6, except that a UV ray was applied to make the cure rate of thepre-cured resin layer on the light-shielding layer about 70% and that ofthe pre-cured resin layer on the surface of the light-transmitting covermember about 90% in the step (b) of Example 10. As a result, the curerate of the light-transmitting cured resin layer on the light-shieldinglayer was about 95%, and elimination of the photo-curable resincomposition was not observed in resultants in all the steps and thefinished liquid crystal display device. Meanwhile, the adhesive statewas evaluated as “C.”

TABLE 3 Comparative Example Example 10 11 12 13 8 Cure Rate of Pre-curedResin Position on Light- 70 70 70 70 70 Layer (%) shielding LayerPosition on Cover 20 40 60 80 90 Member Cure Rate of Cured Resin LayerPosition on Light- 90 95 95 95 95 (%) shielding Layer Position on Cover  95≦   95≦   95≦   95≦   95≦ Member Presence or Absence of Eliminationof Absent Absent Absent Absent Absent Photo-curable Resin CompositionEvaluation of Adhesive State A A A B C

In the case of Comparative Example 8 shown in Table 3, interfacialdelamination was generated in the cured resin layer on thelight-transmitting cover member when the cure rate of the pre-curedresin layer on the light-transmitting cover member was about 90% in thestep (b) (pre-curing step). Thus, the adhesive state was evaluated as“C.”

In contrast, in the cases of Examples 10 to 13, the cure rate of thepre-cured resin layer on the light-shielding layer was higher than thatof the pre-cured resin layer on the light-transmitting cover member inthe step (b) (pre-curing step), so that complete curing of a cure rateof 90% or more could be achieved on the entire light-shielding layer andthe entire light-transmitting cover member in the step (d) (completecuring step). As a result, elimination of the photo-curable resincomposition from between the light-shielding layer and the image displaymember was not observed and the adhesive state was evaluated as A or B.

INDUSTRIAL APPLICABILITY

According to the method of manufacturing an image display device of thepresent invention, a light-transmitting cured resin layer between alight-shielding layer and an image display member can be photo-curedsufficiently without being eliminated from therebetween, and a stepformed between the light-shielding layer and a light-shielding layerforming surface of the light-transmitting cover member can be canceled.Thus, the manufacturing method of the present invention has usefulnessin industrial manufacture of information terminals such as smartphoneswith touch panels and touch pads.

REFERENCE SIGNS LIST

-   1 light-shielding layer-   2 light-transmitting cover member-   2 a light-shielding layer forming surface of light-transmitting    cover member-   3, 3 a, 3 b photo-curable resin composition-   4 step-   5, 5 a, 5 b pre-cured resin layer-   6 image display member-   7 light-transmitting cured resin layer-   10 image display device-   20 attenuate plate-   30 glass base-   31 glass plate

1. A method of manufacturing an image display device where an imagedisplay member and a light-transmitting cover member with alight-shielding layer formed on a peripheral part thereof are stackedvia a light-transmitting cured resin layer formed of a liquidphoto-curable resin composition, such that a light-shielding layerforming surface of the light-transmitting cover member is arranged onthe side of the image display member, the method comprising thefollowing steps (A) to (D): <Step (A)> a step of applying the liquidphoto-curable resin composition to the light-shielding layer formingsurface of the light-transmitting cover member or a surface of the imagedisplay member to a thickness greater than that of the light-shieldinglayer so as to cancel a step formed between the light-shielding layerand the light-shielding layer forming surface of the light-transmittingcover member; <Step (B)> a step of irradiating the applied photo-curableresin composition with a UV ray to pre-cure the photo-curable resincomposition, thereby forming a pre-cured resin layer; <Step (C)> a stepof bonding the light-transmitting cover member to the image displaymember such that the light-shielding layer and the pre-cured resin layerare placed inside; and <Step (D)> a step of irradiating the pre-curedresin layer held between the image display member and thelight-transmitting cover member with a UV ray to completely cure thepre-cured resin layer to stack the image display member and thelight-transmitting cover member via the light-transmitting cured resinlayer, thereby obtaining the image display device.
 2. The manufacturingmethod according to claim 1, wherein the image display member is aliquid crystal display panel, an organic EL display panel, a plasmadisplay panel, or a touch panel.
 3. The manufacturing method accordingto claim 1, wherein in the step (A) the photo-curable resin compositionis applied to a thickness from 1.2 to 50 times that of thelight-shielding layer.
 4. The manufacturing method according to claim 1,wherein in the step (B) the photo-curable resin composition isirradiated with a UV ray to be pre-cured to make the cure rate of thepre-cured resin layer from 10 to 80%.
 5. The manufacturing methodaccording to claim 1, wherein in the step (D) the pre-cured resin layeris irradiated with a UV ray to be completely cured to make the cure rateof the light-transmitting cured resin layer 90% or greater.
 6. Themanufacturing method according to claim 1, wherein the liquidphoto-curable resin composition includes a polyurethane-based(meth)acrylate or a polyisoprene-based (meth)acrylate, and a tackifier.7. The manufacturing method according to claim 1, wherein in the step(B) at least part of the photo-curable resin composition existing on thelight-shielding layer is irradiated with a UV ray to be pre-cured tomake the cure rate of the pre-cured resin layer on the light-shieldinglayer from 30 to 80%.
 8. The manufacturing method according to claim 7,wherein in the step (B) the cure rate of the pre-cured resin layer onthe surface of the light-transmitting cover member is from 0 to 80%. 9.The manufacturing method according to claim 7, wherein in the step (B)the cure rate of the pre-cured resin layer on the light-shielding layeris higher than that of the pre-cured resin layer on the surface of thelight-transmitting cover member.
 10. The manufacturing method accordingto claim 7, wherein a shielding plate to shield a UV ray or anattenuation plate to attenuate a UV ray is disposed between a UV sourceand the applied photo-curable resin composition during UV irradiation inthe step (B).
 11. The manufacturing method according to claim 1, whereinthe photo-curable resin composition includes an acrylate-based oligomercomponent, an acrylic monomer component, a plasticizer component, and aphotopolymerization initiator component, and the plasticizer componentincludes a solid tackifier and a liquid oil component.